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Descripción
Cooler Master is unveiling its flagship air cooler and newest addition to the Stealth Series – the MasterAir MA824 Stealth. With an impressive 8 heat pipe, dual tower design the MA824 Stealth delivers unmatched performance in its class. It carries the Stealth identity with total blackout accents and design. The redesigned dual tower features 8 of the in-house designed Superconductive Composite Heat Pipes, with variable thicknesses for ultra-efficient heat dissipation. Upgraded with a Mobius 120 fan for performance and 43mm of RAM clearance, the staggered Push-Pull setup along with the 135mm performance fan provide absolute cooling. The full coverage nickel plated copper base provides total and seamless contact with the CPU. The MA824 Stealth is bringing performance ready to overshadow its competition.
CaracterÃsticas
8 In-house Designed Superconductive Composite Heat Pipes: 8 In-house designed superconductive composite heat pipes utilize a groove and powder wick structure with dual variable thickness for optimal heat transfer efficiency. Performance Dual Tower: The redesigned dual tower maximizes performance and surface area by incorporating optimized fin density and thickness. 8 Heat Pipe Array: An optimized layout comprising of 8 heat pipes ensures efficient heat transfer across the entire fin area for effective dissipation. Expanded Copper Base: The expanded nickel-plated copper base ensures seamless contact and complete coverage, targeting all heat zones. Minimized base layer thickness enhances heat conductivity, reduces cooler height, and improves case compatibility. Dual Mobius Fans: Equipped with dual variable Mobius fans, providing exceptional silence without compromising performance. Maximum RAM Clearance: 120mm Mobius fan provides 42mm of RAM clearance to fit a wider range of builds without sacrificing performance.
El número de Modelo (ItemModelNumber)
‎MAM-D8PN-318PK-R1
Peso
11.00 Pounds
Dimensiones
6,3 x 5,9 x 6,5 pulgadas
Fabricante es ‎Coolermaster
Destacados
8 In-house Designed Superconductive Composite Heat Pipes: 8 In-house designed superconductive composite heat pipes utilize a groove and powder wick structure with dual variable thickness for optimal heat transfer efficiency., Performance Dual Tower: The redesigned dual tower maximizes performance and surface area by incorporating optimized fin density and thickness., 8 Heat Pipe Array: An optimized layout comprising of 8 heat pipes ensures efficient heat transfer across the entire fin area for effective dissipation., Expanded Copper Base: The expanded nickel-plated copper base ensures seamless contact and complete coverage, targeting all heat zones. Minimized base layer thickness enhances heat conductivity, reduces cooler height, and improves case compatibility., Dual Mobius Fans: Equipped with dual variable Mobius fans, providing exceptional silence without compromising performance., Maximum RAM Clearance: 120mm Mobius fan provides 42mm of RAM clearance to fit a wider range of builds without sacrificing performance.
Valoraciones
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